PCB Assembly

RACOM has the latest technologies for PCB assembly. We offer spare capacities in our production for use by other companies, giving them the unique opportunity to use top-class equipment to assemble their boards.

Datasheet

https//www.racom.eu/eng/services/pcb-assembly.html

Technology

Assembly – 6 machines
Soldering – reflow and wave
Automatic optical inspection
Storage in smart cabinets

Why RACOM

Own SMT and THT assembly since 1997
All production in the Czech Republic
PCB design consultation
Option for sourcing components

Reliability

100% traceability
3D Automated optical inspection
X-ray inspection
Temperature cycling of assembled boards

Quality

ISO 9001
ISO 14001
RoHS, WEEE, WFD
Own products with MTBF >100 years

Our production plant in Blansko is equipped with the latest technologies, which we regularly update. We have more than 30 years of experience in assembling the most demanding boards and implement the latest trends and procedures on an ongoing basis. We will be happy to advise you on how to design your boards so that the subsequent assembly and soldering goes without problems.

Take advantage of the opportunity to have your boards assembled in the same quality as RACOM products. Our devices have MTBFs exceeding 100 years and are installed in 120+ countries, from the poles to the equator.

Preparation

Consultation

Our staff have many years of experience that they will be happy to share with you. We offer the option of consultations at the design stage of your boards, so that the subsequent assembly and soldering is trouble-free.

Years of experience
We have been designing boards since 1989
Since 1997 we have been running our own SMT centre

Components sourcing

If you are interested, we are able to provide a comprehensive service, not only to assemble your boards, but also to ensure the supply of components and PCBs from our suppliers for your products.

We use thousands of types of passive and active components for our products. We have many years of experience in purchasing them and ensuring smooth deliveries. We purchase parts directly from manufacturers or authorized distributors. We have been cooperating with our suppliers at length, and spend tens of millions with them every year, which gets reflected in our prices and delivery conditions.

Storage

MP DRY CABINET

Environments with relative humidity below 1%
Temperature settings up to 60 °C can be set for fast drying
Proper storage of components increases product reliability

Marking

Laser ASYS INSIGNUM 4000

PCB Laser Marking
Solder resist marking
Panel dimensions up to 500 × 500 mm
Smallest spot size ≥ 0.127 mm
The marking is verified by a integrated scanner and saved

Production

Paste and glue application

Before assembling SMD components, a precisely defined amount of solder paste is applied to the soldering points for reflow soldering. If the SMD components are soldered on a wave, glue is applied to the SMD component centre, to keep it in position during subsequent soldering. All devices are stencil-printer, fully automated and with integrated control of the correct application of paste or glue.

ERSA VERSAPRINT S1 2D

Max. board size 550 × 500 mm
Printing precision ± 25 μm @ 6 Sigma
Print repeatability ± 12.5 μm @ 6 Sigma
100% 2D optical print inspection via linear scanner

EKRA SERIO 4000 Compact

Max. board size 510 × 510 mm
Printing precision ± 12.5 μm @ 6 Sigma
Print repeatability ± 20 μm @ 6 Sigma
100% 2D optical print inspection via camera

MPM Accuflex

Max. board size 584 × 508 mm
Printing precision ± 25 μm @ 6 Sigma
Print repeatability ± 25 μm @ 6 Sigma
100% 2D optical print inspection via camera

SMT assembly

We have a total of six Mycronic (Mydata) pick-and-place machines available. For maximum capacity in placement speed and especially in the number of feeders, we always use two machines connected in one line. All pick-and-place machines have optical guidance and centring. Before assembly, a mechanical check is carried out ‘on-the-fly’ and for passive components, diodes and transistors, the basic electrical parameters are tested. This minimizes the possibility of confusion or use of defective material.

SMD 0201 components are fitted as standard, we are also able to fit 01005 size. Our equipment allows us to mount all types of SOIC, PLCC, TSOP, QFP, BGA packaging with pitch from 0.25 mm.

First line
- MY300SX – 24,000 CPH., 192 feeders (8 mm), max. board size 460 × 510 mm
- MY300SX – 24,000 CPH, 192 feeders (8 mm), max. board size 460 × 510 mm
Second line
- MY100SX – 24,000 CPH, 192 feeders (8 mm), max. board size 460 × 510 mm
- MY100LX – 16,000 CPH, 192 feeders (8 mm), max. board size 460 × 510 mm

There are two more, older generation pick-and-place machines MY15 and TP11, which we use for simpler boards or prototypes.

Reflow soldering

Reflow of solder paste and glue curing is carried out in a continuous hot-air system.

ERSA HOTFLOW 3/20e

Ten soldering zones
Individual temperature settings for each zone
Lead and lead-free pastes
All kinds of glues

THT mounting

For mounting of components with wire leads and non-standard SMD components, we are equipped with manual workplaces, equipped for forming and manipulation. The workplaces include control points equipped with equipment for carrying out in-process controls, including optical inspection. Manual refilling is usually done after reflow soldering.