RACOM has the latest technologies for PCB assembly that we use to manufacture our own wireless data equipment with MTBF >100 years.
We also offer spare capacity in our manufacturing facility to other companies who have the unique opportunity to use our state-of-the-art equipment to assemble their boards.
You can also take advantage of a comprehensive delivery, where we add mechanical parts to the boards, assemble the equipment and completely commission it.
Our production plant in Blansko is equipped with the latest technologies, which we regularly update. We have more than 30 years of experience in assembling the most demanding boards and implement the latest trends and procedures on an ongoing basis. We will be happy to advise you on how to design your boards so that the subsequent assembly and soldering goes without problems.
Take advantage of the opportunity to have your boards assembled in the same quality as RACOM products. Our devices have MTBFs exceeding 100 years and are installed in 130+ countries, from the poles to the equator.
Our staff have many years of experience that they will be happy to share with you. We offer the option of consultations at the design stage of your boards, so that the subsequent assembly and soldering is trouble-free.
If you are interested, we are able to provide a comprehensive service, not only to assemble your boards, but also to ensure the supply of components and PCBs from our suppliers for your products.
We use thousands of types of passive and active components for our products. We have many years of experience in purchasing them and ensuring smooth deliveries. We purchase parts directly from manufacturers or authorized distributors. We have been cooperating with our suppliers at length, and spend tens of millions with them every year, which gets reflected in our prices and delivery conditions.
MP DRY CABINET
Before assembling SMD components, a precisely defined amount of solder paste is applied to the soldering points for reflow soldering. If the SMD components are soldered on a wave, glue is applied to the SMD component centre, to keep it in position during subsequent soldering. All devices are stencil-printer, fully automated and with integrated control of the correct application of paste or glue.
We have a total of six Mycronic (Mydata) pick-and-place machines available. For maximum capacity in placement speed and especially in the number of feeders, we always use two machines connected in one line. All pick-and-place machines have optical guidance and centring. Before assembly, a mechanical check is carried out ‘on-the-fly’ and for passive components, diodes and transistors, the basic electrical parameters are tested. This minimizes the possibility of confusion or use of defective material.
SMD 0201 components are fitted as standard, we are also able to fit 01005 size. Our equipment allows us to mount all types of SOIC, PLCC, TSOP, QFP, BGA packaging with pitch from 0.25 mm.
There are two more, older generation pick-and-place machines MY15 and TP11, which we use for simpler boards or prototypes.
Reflow of solder paste and glue curing is carried out in a continuous hot-air system.
For mounting of components with wire leads and non-standard SMD components, we are equipped with manual workplaces, equipped for forming and manipulation. The workplaces include control points equipped with equipment for carrying out in-process controls, including optical inspection. Manual refilling is usually done after reflow soldering.
SEHO SYSTEM 8140 PCS
SEHO SYSTEM 1135 G
DCT -InJet® 388 DOUBLE TRIPLE CRRD
Finally, all PCBs undergo manual optical inspection using microscopes and touchscreen computers and repair software.
As needed, we have 3D X-ray available.
Request For Quotation
SMT centre Blansko
RACOM s.r.o.
Olomučany 378
679 03
Česká republika
Tel.: + 420 601 053 813
E-mail: blansko@racom.eu
Operating hours
Monday – Friday 08:00 to 16:00
Local time: 06:32
© 2025 RACOM s.r.o. All Rights Reserved.
